Greenforest I/O
The Simple Beauty of Complexity

Computational substrates, circuit fabrics, browser-native GPU experiments, magnetic devices, digital radio, and self-assembling hardware ideas by Brian Greenforest.

Public Work

Circuit Bit-serial bubbles-free multiplier

A positive-number serial multiplier built in Logisim. After the pipeline fills, the next pair of bit-serial arguments can enter immediately after the previous pair, with output bits continuing on every clock.

Live Demo Cartilage nested-instantiation demo

A browser/GPU demo of a tiled computational fabric where regions can instantiate and replace daughter regions through local reconfiguration ports and serial bitstreams.

Paper Boolean Algebra Is All That Is Required

A printable reference paper on a multiplexer-only Boolean model of universal computation built from wires, constants, 2:1 multiplexers, feedback, configuration registers, and unbounded tiling.

Article Sequence From the ground up

A step-by-step exploration of the beautiful world of computation, mathematics, physics, and engineering, with browser-native WebGL experiments and runnable code.

Archive Guide Experiments with cellular automata

Executable WebGL automata exploring reversible routing, information-conservative dynamics, machine-like heat, and organic large-scale patterns.

Research Notes

Digital Radio

A 1-pin fully digital SDR receiver frontend and a 1-pin resonant-tank transmitter driven by a fully digital SDM Weaver modulator in Verilog, with crude PCB prototypes and FM receive videos.

RF prototype and signal-processing workbench
RF and digital-radio experiments.
Magnetics

Magnetic material properties, magnetic amplifier behavior, second-harmonic modulation, and diodeless circuit ideas collected while studying how to build useful circuits without semiconductor fabrication.

Backprop

Online backpropagation engines wired from primitive operations: multiplication, addition, fan-out, and elementary functions carrying derivative feedback directly through the computation.

Fabrication

A smart-dust substrate proposal using ordinary-fab steps: through-wafer dicing into micrometer-scale chip modules, conformal SiO2 coating, and adjacent capacitive and inductively coupled links for actuation, power, clock, and data transfer.

Wafer dicing using dry etching on standard tapes and frames

Updates

Project Note Research progress updates

Older notes from web-development and research-progress work.